Electrolyte and method of electrodepositing copper.



UNITED STATES Parana OFFICE.

EDWARD F. KERN, OF KNOXVILLE, TENNESSEE, ASSIGNOR 0F ONE-HALF T0 PERCY S.

BIB/OWN, OF NEW YORK, N. Y.

ELECTROLYTE AND METHOD OF ELECTRODEPOSITING COPPER.

No Drawing.

To all whom it may concern: 1

Be it known that I, EDWARD F. KERN, citizen ofthe United States, residing at Knoxville, in the county of Knox and State of Tennessee, have invented certain new and useful Improvements in Electrolytes and Methods of Electrodepositing Copper, of which the following is a specification.

This invention relates to an improved process for the electrodeposition of copper.

The invention also relates to an electrolyte for use in the practice of the saidprocess.

I have discovered that a smooth, dense, coherent and adherent deposit of copper may be obtained by the electrolysis of a bath containing fluo-silicate of copper in solution and that particularly good results may be obtained by the use of a soluble alkaline or alkaline earth fluo-silicate preferably ammonium duo-silicate or in some cases aluminium fiuo-silicate with the copper'fiuo-silicate and that the operation may be further improved in some cases by the additional employment of an alkaline fluorid as ammonium fluorid either alone or with an organic salt preferably an alkaline tartrate.

In a bath for coating iron, steel or zinc, I prefer to employ the following materials in the proportions specified:

Water 100 parts. Copper fluo-silicate 12 Ammonium duo-silicate 8 Ammonium tartrate 6 Ammonium fiuorid 5 or more In a bath for coating brass, copper or certain other metals, I preferably employ the ii 'lollowing materials in the proportions speciater 100 parts. Copper fluo-silicate 12 Ammonium fluo silicate 8 Gelatin or tannin 0.06

Specification of Letters Patent.

Application filed September 1, 1909. Serial no;

Patented Jan. as, 1910.

tion in which case I preferably employ aluminium tluo-silicate-instead of ammonium fiuo-silicate.

It is to be understood that in the bath for depositing copper upon brass, copper or certain other metals aluminium fluo-silicate is the equivalent of ammonium lino-silicate for the purposes of my process.

I have found that it is advantageous, when using the bath in an acid condition as here inbefore referred to, to add gelatin or tannin to the bath preferably in the proportion of one part of the solid gelatin or one part of the concentrated extract of tannin to about 2,000 parts of the bath. The gelatin and the tannin mentioned are, it is to be understood, equivalents for'use my process and either or both may be employed as desired.

In the electrolysis of my improved bath, I employ an anode of copper or an anode consist-ing of an alloy the greater part of which 1s copper.

In order to restrain the separation of silica in the operation of my process, I have found it advisable to add ammonium fluorid from time to time, this material bein added to the bath at the outset in the pre erred proportion of one part by weight of ammonium fluorid to one or more parts of the copper fiuo-silicate in the electrolyte. The addition of the ammonium fluorid thereafter may be made as required.

While I have stated the proportions of the materials which I prefer to employ, it will be understood that these proportions may be widely varied, and that commercially satisfactory results may be obtained, omitting certain constituents of the bath as hereinbefore mentioned or by replacing the ammonium duo-silicate with aluminium fiuo-silicate.

l/Vhile I have particularly referred to the use of an alkaline duo-silicate in connection with the fluo-silicate of copper it is to be understood that the use of an alkaline earth silicate with such fluo-silicate of copper is contemplated as within the purview of my invention and the scope of the appended claims, an alkaline earth silicate being the equivalent of an alkaline silicate for use in my process.

Having described my invention, I claim:

1. A process of electrodepositing copper, which consists in electrolyzing a solution containing fiuo-silicate of copper and a soluble alkaline fiuo-silicate.

2. A process of electrodepositing copper, which consists in electrolyzing a solution containing fluo-silicate of copper and ammonium fiuo-silicate.

3. A process of electrodepositing copper, which consists in electrolyzing a solution containing fluo-silicate of copper, an alkaline fluo'silicate and an alkaline fluorid.

4. A process of electrodepositing copper, which consists in electrolyzing a solution containing fluo-silicate of copper, an alkaline fluo-silicate and ammonium fiuorid.

5. A process of electrodepositing copper, which consists in elcctrolyzing a solution containing fiuo-silicate of copper, ammonium fiuo-silicate and ammonium fiuorid.

6. A process of electrodepositing copper, which consists in electrolyzing a solution containing fiuo-silicate of copper, an alkaline fiuo-silicate, an alkaline fluorid and an organic salt.

7. A process of electrodepositing copper, which consists in electrolyzing a solution containing fiuo-silicate of copper, an alkaline fluo-silicate, an alkaline fiuorid and an alkaline tartrate.

8. A process of electrodepositing copper, which consists in electrolyzing a solution containing fiuo-silicate of copper, an alka-.

line fiuo-silicate, an alkaline fluorid and ammonium tartrate.

9. A process of electrodepositing copper, which consists in electrolyzing a solution containing fluo-silicate of copper, ammonium fluo-silicate, ammonium fluorid and ammonium tartrate.

10. A process of electrodepositing copper, which consists in electrolyzing a solution containin fluo-silicate of copper and ammonium uo-silicate and adding ammonium fluorid thereto from time to time during the electrolysis.

11. An electrolyte comprising fluo-silicate of copper and an alkaline fluo-silicate'.

12. An electrolyte comprising fiuo-silicate of copper and ammonium fluo-silicate.

13. An electrolyte com rising flue-silicate of copper, an alkaline uo-silicate and an alkaline fluorid.

14. An electrolyte comprising fiuo-silicate of copper, an alkaline fluo-silicate and ammonium fiuorid.

15. An electrolyte comprising fluo-silicate of copper, ammonium fluo-silicate and ammonium fluorid.

16. An electrolyte comprising fluo-silicate of copper, an alkaline fluo-silicate, an alkaline fluorid and an organic salt.

17 An electrolyte comprising fluo-silicate of copper, an alkaline fiuo-silicate, an alkaline fluorid and an alkaline tartrate.

18. An electrolyte comprising fiuo-silicate of copper, an alkaline fiuo-silicate, an alkaline fiuorid, an organic salt and ammonia.

19. An electrolyte comprising fluo-silicate of copper, ammonium flue-silicate, ammonium fiuorid, ammonium tartrate and ammonia.

In testimon whereof I afiix my signature in presence 0 two witnesses.

EDWARD F. KERN. Witnesses R. M. DoLL, J. T. GARRETT. 

